Positioning apparatus, exposure apparatus using thereof and device manufacturing method

ABSTRACT

A positioning apparatus including a movable member having a plurality of magnets, and a plurality of coils arranged in X- and Y-axial directions, for displacing the movable member in the X- and Y-axial directions, and in a rotational direction around the Z-axis.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.11/264,881, filed Nov. 1, 2005, which claims the benefit of JapanesePatent Laid-Open No. 2004-323759, filed Nov. 8, 2004, which are herebyincorporated by reference herein in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a positioning apparatus, and inparticular, though not exclusively, to a positioning apparatus used inan exposure apparatus and/or survey equipment.

2. Description of the Related Art

A conventional exposure apparatus can have a positioning apparatus forpositioning a wafer or a reticle. Japanese Patent Laid-Open No.2004-254489 discusses a stage unit using a surface motor, as a waferstage, for positioning a wafer.

FIG. 8A illustrates a top view which shows the wafer stage 8 discussedin Japanese Patent Laid-Open No. 2004-254489, and FIG. 8B illustrates asectional view which shows the wafer stage 8 as viewed sidewise.

Referring to these figures, a movable member 1 (stage) includes a magnetunit 2 in which permanent magnets are arranged in the so-called Halbacharray at its bottom surface, and a base member 3, which has a coil unit4 in which a plurality of coils are arranged. Magnetic fluxes generatedfrom these permanent magnets and currents fed to the coils produce aLorentz's force by which the movable member 1 is displaced.

FIGS. 9A to 9B illustrate views which show a configuration of coils andpermanent magnets discussed in the Japanese Patent Laid-Open No.2004-254489, as viewed from above in FIGS. 8A and 8B, and in which thestage is shown being see-through in order to facilitate theunderstanding of the configuration thereof. A plurality of coils 5having linear portions in the X-axial direction are arranged in theY-axial direction, and current having predetermined phases are fed tothose of the coils 5 which are located underneath the magnets so as todisplace the stage in the Y-axial direction. Further, with the provisionof a plurality of coils having linear portions in the Y-axial direction,which are arranged in the X-axial direction, the stage can be displacedin the X-axial direction. It is noted here that the magnet unit 2 hassuch a magnetic configuration that the Halbach array has deficient parts6 from which permanent magnets are in part removed as shown in FIG. 9A,or the Halbach array has additional parts in which permanent magnets arein part added 7 as shown in FIG. 9B. With this magnet configuration,currents are fed to coils underneath a pair of deficient parts 6 oradditional parts 7 so as to induce forces in reverse direction,respectively therefrom, so as to cause the stage 1 to displace in the θzdirection (a rotational direction around the Z-axis).

As illustrated in FIG. 9A, if defective portions are provided inpermanent magnets having an array sequence, permanent magnets used forX- and Y-axial displacements can be removed, resulting in decreaseddrive efficiency. As illustrated in FIG. 9B, if additional portions areprovided in permanent magnets having an array sequence, separates coilsfor θz drive can be used in addition to coils for X- and Y-axial drivesin order to increase efficiency of the drive. In this case, since acurrent applied for the θz drive is different from currents applied forthe X- or Y-axial drive, different current drives can be used, that is,an increase in the number of current drivers results in increased costs.Further, since the additional magnets overhang outward by a largedegree, the stage itself would have a larger size, the larger thecarriage, the larger the apparatus and as well the larger the heatingvalue of a drive unit, resulting in difficulty in maintaining increasedaccuracy.

SUMMARY OF THE INVENTION

At least one exemplary embodiment is directed to a positioning apparatusfor positioning an original to be exposed, a matter to be exposed, orpositioning a test object to a predetermined position.

At least one exemplary embodiment is directed to a positioning apparatusincluding a movable member having a plurality of magnets, a plurality ofcoils arranged in X- and Y-axial directions, for displacing the movablemember in these directions. The plurality of magnets constitute a firstmagnet unit for generating forces in X- and Y-axial directions, and asecond magnet unit for generating a force in a direction around theZ-axis. The second magnetic unit being provided so as to cause at leasta part of coils for generating a force in the X-axial direction togenerate a force in a rotating direction around the Z-axis, whilereducing generation of a force in the Y-axial direction. Incidentally,the X- and Y-axial directions can be used for defining two orthogonaldirections in one and the same plane, are synonymous with a firstdirection and a second direction orthogonal the first direction.

Further, the second magnet unit can include a plurality of magnetswhich, in at least one exemplary embodiment, are configured so thatN-poles and S-poles are alternately arranged in the X-axial direction.The first magnetic unit can include a plurality of magnets, where in atleast one exemplary embodiment are configured so that N-poles andS-poles are alternately arranged in X- and Y-axial directions. It isnoted here that “the plurality of magnets configured so that N-poles andS-poles are alternately arranged”, are those which are located so thatthe polarities of N-poles and S-poles are alternately opposed to coilunits.

At least one further exemplary embodiment is directed to a positioningapparatus for displacing a movable member with the use of magnets andcoils, at least two dimensionally, which is movable in a rotationaldirection while (1) increasing the drive efficiency, and/or (2)decreasing of the size of the movable member and/or (3) decreasing thecost.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments (with reference to theattached drawings).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plane view illustrating a magnet configuration of a surfacemotor type wafer stage in accordance with at least one exemplaryembodiment;

FIG. 2 is a plane view illustrating a positional relationship between amagnetic unit and a coil unit during movement in an X-axial direction;

FIG. 3 is a plane view illustrating a positional relationship between amagnetic unit and a coil unit during movement in a θz direction;

FIG. 4 is a plane view illustrating a positional relationship between amagnetic unit and a coil unit during movement in a Y-axial direction;

FIG. 5 is a side view illustrating an exposure device;

FIG. 6 illustrates a view for explaining a device manufacturing method;

FIG. 7 illustrates a view for explaining a wafer process;

FIG. 8A is a top view illustrating a surface motor type wafer stage;

FIG. 8B is a sectional view illustrating the surface motor type waferstage shown in FIG. 8A;

FIGS. 9A and 9B are views illustrating magnet configurations ofconventional surface motor type wafer stages.

DESCRIPTION OF THE EMBODIMENTS

The following description of at least one exemplary embodiment is merelyillustrative in nature and is in no way intended to limit the invention,its application, or uses.

Processes, techniques, apparatus, and materials as known by one ofordinary skill in the art may not be discussed in detail but areintended to be part of the enabling description where appropriate. Forexample magnets are discussed and any material that can be used to formelements of the magnets should fall within the scope of exemplaryembodiments (e.g., iron).

Additionally the actual size of the elements of exemplary embodimentsmay not be discussed, however any size from macro to micro and nano areintended to lie within the scope of exemplary embodiments (e.g., magnetswith diameters of nanometer size, micro size, centimeter, and metersizes). Additionally exemplary embodiments are not limited to movingwafer stages in exposure systems, for example the system can be designedfor use in moving units between stages in a fabrication process.

Examples of several exemplary embodiments are described below withreference to the accompanying drawings.

Exemplary Embodiment 1

Referring to FIG. 8A which is a top view illustrating a stage unit in anexemplary embodiment 1 and FIG. 8B which is a sectional viewillustrating the stage unit as viewed sidewise, a stage (movable member)1 carrying thereon an object to be positioned, is movable in X- andY-axial directions on a base member 3. The stage 1 has, at its bottomsurface, a magnetic unit 2 which will be described later. The basemember 3 has, at its surface opposing the magnetic unit 2, serving aplaten as a whole. The coil unit 4 has a first coil layer in which aplurality of coils are arranged in an X-axial direction, each coilhaving a linear portion in a Y-axial direction so that its longitudinaldirection is laid in the Y-axial direction. Underneath the first coillayer (downward in a minus Z-axial direction, into the page), there is asecond coil layer in which a plurality of coils are arranged in Y-axialdirection, each coil having a linear portion in the X-axial direction sothat its longitudinal direction is laid in the X-axial direction.Further, in accordance with the exemplary embodiment, the coil unit 4can include additional coil layers in which coils are arranged, eachhaving a linear portion in a predetermined direction. The coils can besecured to the base member 3, and the coil unit 4 can be coveredthereover with a jacket which is not shown. With this configuration,heat which is generated when current is fed to the coil can be cooled byfeeding coolant through the jacket or by arranging cooling pipes amongthe coils, or by hollow coils where coolant flows through the center ofthe hollow coils.

FIG. 1 is a top view illustrating the stage as see-through in order tofacilitate the understanding of the configuration of magnets arranged atthe bottom surface of the stage. Magnets 21 in FIG. 1 are main-polemagnets which are magnetized in the Z-axial (perpendicular) direction,having N-poles on the −Z side (the bottom surface of the stage). Magnets22 are main pole magnets 22 which are magnetized in the Z-axialdirection, having S-poles in the −Z side. Magnets 23 are commutatingpole magnets which are magnetized in a horizontal direction (e.g., alongthe X-Y plane), and are arranged so that poles at their ends arecoincident with that of the main pole magnets adjacent thereto, asviewed from the bottom surface. That is, the so-called Halbach array istwo-dimensionally formed in the X- and Y-axial directions. Note thatexemplary embodiments are not limited to the magnets being arranged in aHalbach array. Such a discussion is meant for illustrative non limitingpurposes.

Thus, in such a Halbach array, the magnets 22, 23 are symmetricallyarranged in the X- and Y-axial directions so as to form a magnet unit 24which is substantially square as a whole. Magnet units 25 a, 25 b arearranged on both sides of the magnet unit 24 as viewed in the X-axialdirection, in the non-limiting example illustrated each includes fourmagnets which are arranged in a row so as that S-poles and N-pole areopposed to the coil unit 4, S-poles and N-pole being alternately set inthe X-axial direction. Note any number besides four can be used in atleast one exemplary embodiment. The magnet units 25 a and 25 b can beprovided in pair, being spaced from each other by a distance L in theY-axial direction, that is, the magnet unit 24 is interposedtherebetween in the Y-axial direction.

Explanation will be made of a positional relationship between the magnetunit 2 and the coil unit 4. Referring to FIG. 2 in which the second coillayer is not shown but only the first coil layer is shown. Further, longlength coils can be arranged in order to displace the stage in the X-and Y-axial directions by long strokes, the coils shown in FIG. 2 have ashort-length in order to facilitate the explanation thereof. Further,the coils are shown by a number (e.g., CX1-CX17) which is less than thetotal number thereof in order to facilitate the explanation thereof.

Explanation will be hereinbelow made of a manner of displacing the stagein the X-axial direction with reference to FIG. 2.

The coils are arranged in the X-axial direction at pitches CP, and inthe magnet unit 24 (FIG. 1), the magnets having one and the same polesare arranged in the X-axial direction at pitches MP. It is noted herethat the pitches CP and MP can vary and in at least one exemplaryembodiment satisfies the following equation;MP=4/3*CP  (1)

Magnetic fluxes produced by the magnets in the coil unit 24 (FIG. 1) ofthe stage exhibit a magnetic flux density distribution having apredetermined period. If the magnets are in the Halbach array, anaveraged value of the magnetic flux density distribution in the Z-axialdirection at the position of the coil unit can be approximated to asinusoidal wave substantially having a period MP with respect to theX-axis.

Referring to FIG. 2, when the stage located at an X-axial position x=0is displaced in a range 0<x<CP, a thrust fi (i=2 to 15) which is inducedin the X-axial direction from a coil cxi (i-th coil from the left sideof the figure) fed thereto with a current Ii [A] is exhibited by thefollowing functions:f2,f6,f10,f14=−Ii*Ki*cos(2*π/MP*x)  (2)f4,f8,f12=Ii*Ki*cos(2*π/MP*x)  (3)f3,f7,f11,f15=Ii*Ki*sin(2*π/MP*x)  (4)f5,f9,f13=−Ii*Ki*sin(2*π/MP*x)  (5)where Ki is a constant. It is noted that the value Ki is slightlydifferent for f4, f5, f12, f13 from those for the other thrusts inducedby the other coils, these differences can be negligible (Ki≈K) in viewof the control of macro movements.

Further, if a current Ii (i=2 to 15) is fed to a coil cxi (i-th coilfrom the left side in the figure) as follows:I2,I6,I10,I14=−I*cos(2*π/MP*x)  (6)I4,I8,I12=I*cos(2*π/MP*x)  (7)I3,I7,I11,I15=I*sin(2*π/MP*x)  (8)I5,I9,I13=−I*sin(2*π/MP*x)  (9)a resultant force (f2+f3) is exhibited by:

$\begin{matrix}\begin{matrix}{\left( {{f\; 2} + {f\; 3}} \right) = {{I*K*\cos^{\bigwedge}2\left( {2*{\pi/{MP}}*x} \right)} +}} \\{I*K*\sin^{\bigwedge}2\left( {2*{\pi/{MP}}*x} \right)} \\{= {I*K}}\end{matrix} & (10)\end{matrix}$

Further, for every y resultant force (f4+f5), (f5+f7), (f8+f9),(f10+f11), (f12+f13) and (f14+f15), I*K can be similarly obtained, andaccordingly, 7*I*K is obtained as the total resultant force. That is,whenever there is a desire to induce a force F, the current I can be setto:I=F/7K  (11)

A laser interferometer which is not shown can be used in order tomeasure a position x of the stage. It should be noted here that thephase of the current Ii is set so as to be coincident with that of themagnetic density distribution. That is, a measured value obtained by thelaser interferometer can be used as a feed-back signal for the positioncontrol of the stage, and used to compute a phase of the above-mentionedcurrent.

A manner of displacing the stage in the Y-axial direction is carriedout, similar to that for displacing the stage in the X-axial direction.That is, by measuring a position of the stage in the Y-axial direction,and predetermined currents are fed to coils in the second coil layer soas to induce a predetermined thrust in the Y-axial direction. Referringto FIG. 4 which shows only the second coil layer without the first coillayer. Further, several coils having a long length should be arranged inorder to displace the stages in the X- and Y-axial directions by a longstroke, coils having a shorter length are shown by a number less thanthe number in FIG. 4 in order to facilitate the explanation thereof.

The coils (e.g., CY1-CY18) are arranged in the Y-axial direction atpitches CPY, and in the magnetic unit 24, the magnets having the one andthe same pole are arranged in the Y-axial direction at pitches MP whichare set as follows;MPY=4/3*CPY  (1)

Magnetic fluxes generated by the magnets in the magnet unit 24 (FIG. 1)of the stage exhibit a magnetic flux density distribution having apredetermined period at the position of the coil unit. Since the magnetsare arranged in a Halbach array, an averaged value of the magnetic fluxdensity distribution in the Z-axial direction at the position of thecoil unit, can be approximated to a sinusoidal wave substantially havinga period MPY. It is note here that the Halbach array istwo-dimensionally formed so as to cause difference in the magnetic fluxdensity distribution among coil parts, and accordingly, “the averagedvalue of the magnetic flux density distribution” is used.

A manner of displacing the stage in the Z-axial direction is similar asmentioned above, except that a phase of current fed to each coil isdifferent from that for the displacement in the X- and Y-axial directionby 90 deg. By shifting the phase by 90 deg. a Z-axial thrust can beinduced between the magnetic unit at the bottom surface of the stage andthe first coil layer or the second coil layer.

In order to displace the stage in the Z-axial direction with the firstcoil layer, a certain number of coils can be chosen, for example twelve(12) coils cx3 to cx14. In the case of using 12 coils, the current valueI for inducing a thrust F can be set to a value obtained by multiplying(F/Kz/6) with a phase of each coil, where Kz is a coefficient.

Explanation will be hereinbelow made of displacement of the stage in aθx direction (rotational direction around the X-axis) or a θy direction(rotational direction around the Y-axis).

Referring to FIG. 2, a thrust in the −Z-axial direction is induced withthe use of the coils in the stage on the left side (−X side) of thecenter line A while a thrust in the +Z-axial direction is induced withthe use of the coils in the stage on the right side (+X side) of thecenter line A, and accordingly, a thrust in the θy direction can beinduced in the stage.

Similarly (FIG. 4), a thrust in the +Z-axial direction can be inducedwith the use of the cols in the stage on the upper side (+Y side) of thecenter line B while a thrust in the −Z-axial direction can be inducedwith the use of the coils in the stage on the lower side (−Y side) ofthe center line B, and accordingly, a thrust in the θx direction can beinduced in the stage.

The positions of the stage in the θx and θy directions can be measuredby providing two optical axes of laser interferometers for measuringpositions respectively in the Y- and X-axial directions, which arespaced in the Z-axial direction. Specifically, it can be obtained bydividing a difference between measured values along the two optical axeswith the space between two optical axes in the Z-axial direction.

As stated above, in order to induce thrusts in the X-, Y- and Z-axialdirections, and in the θx and θy directions, the magnet unit 24 (FIG. 1)in which the magnets are arranged in the Halbach array is used. It isnoted that the magnets are tightly laid in the magnet unit in a squareshape in order to enhance the thrust efficiency, although any shape isin accordance with exemplary embodiments.

Next, explanation will be made of a manner of displacing the stage in aθz direction with reference to FIG. 3. In order to induce a thrust inthe θz direction in the stage, coils cx4, cx5, cx12 and cx13 locatedunderneath the magnetic units 25 a, 25 b are used.

When current I′i [A] is fed to each coil, thrusts f′4, f′5, f′12, f′13in the X-axial direction are exhibited as follows:f′4,f′12=I′i*K′*cos(2*π/MP*x)  (12)f′5,f′13=−I′i*K′*sin(2*π/MP*x)  (13)where K′ is a constant and the differences between K′ values betweencoils is deemed negligible. Further, currents I′4, I′5, I′12, I′13 fedto the coils (cx4, cx5, cx12 and cx13) are set as follows:I′4=I*cos(2*π/MP*x)  (14)I′5=−I*sin(2*π/MP*x)  (15)I′12=−I*cos(2*π/MP*x)  (16)I′13=I*sin(2*π/MP*x)  (17)That is, if the current values fed to the coils cx12, cx13 are set tovalues obtained by multiplying the current values fed to the coils cx4,cx4 with −I, resultant force (f′4+f′5) and (f12+f13) are exhibited asfollows:f′4+f′5=I′*K′*cos ^2(2*π/MP*x)+I′*K′*sin ^2(2*π/MP*x)=I′*K′  (18)f′12+f′13=−I′*(K′*cos ^2(2*π/MP*x)+K′*sin ^2(2*π/MP*x))=−I′*K′  (19)

Since the magnet units 25 a, 25 b are spaced from each other in theY-axial direction by the distance L, the stage is driven by the thrustsexhibited by the formulae (18) and (19) with the use of respectivedifferent coils. These thrusts act upon the stage as a couple of forces,and accordingly, a moment θzm in the θz direction, acting upon thestage, is exhibited as follows:θzm=I′*L*K′  (20)That is, in order to induce a moment having a value Mz, a current value:I′=θzm/LK′  (21)is set in the formulae (14) to (17).

In order to control the position of the stage, the sum of the currentvalue I for the thrust in the X-axial direction and the current value I′for the thrust in the θz direction is fed as a current instruction valueto the coils cx4, cx5, cx12 and cx13. Thus, the coils are used for boththrust in the X-axial direction and thrust in the θz direction, andaccordingly, it is possible to reduce the provision of an additionalcurrent driver for a thrust in the θz direction.

In FIG. 4, current is fed to coils cy3 to cy16 in order to inducethrusts in the Y-axial direction and the θx direction. Since in thenon-limiting example discussed no current is fed to coils cy1, cy18located underneath the magnet units 25 a, 25 b, no forces are inducedbetween the coils and the magnet units 25 a, 25 b. Further, in each ofthe magnet units 25 a, 25 b, four magnets can be arranged in a singlerow in the X-axial direction so that N-poles and S-poles are alternatelyopposed to the coil unit while a force induced by a magnetic flux froman N-pole magnet is set to be equal to that from an S-pole magnet. Thus,even though currents run through the coils cy1, cy18, the action offorces by these currents and the magnets in the θz magnet units can becancelled out as internal forces, and accordingly, nothing is affectedto a rigid-body motion applied to the stage. That is, the magnet units25 a, 25 b are provided so that those coils which induce forces in theX-axial direction induce forces in the rotational direction around theZ-axis but those coils which induce forces in the Y-axial direction donot induce forces in the rotational direction around the Z-axis.

Such a case that the stage is displaced in the X-axial direction by onepitch CP so that its coordinate comes to x=CP, is analogous to such acondition that an (n+1)-th coil is located at the position of an N-thcoil at x=0. Thus, by iterating the drive manner which has beenexplained hereinabove with periods of the coil pitches CP and CPY, adesired thrust can be induced at an arbitrary stage position. In thisexemplary embodiment, although the magnet units 25 a, 25 b are arrangedso as to interpose the magnet unit 24 therebetween in the Y-axialdirection, there can also used such a configuration that a single magnetunit 25 can be arranged on one side of the magnet unit 24. In thisconfiguration, the moment θzm in the θz direction induced in the stageis exhibited as follows;θzm=0.5*I′*L*K′  (22)It is noted that the formula 22 can be satisfied if the gravitationalcenter of the stage is located at the center of the stage. If thegravitational center position of the stage is deviated from the stagecenter, it is sufficient to add the deviation as a correction value inthe moment calculation. Further, in the case of an arrangement of themagnet unit only on one side, since only one of the formulae (18) and(19) gives a thrust, no couple of forces are induced so that a thrust isinduced in the X-axial direction by a current for inducing a thrust inthe θz direction. Such a thrust can be managed by a current value forinducing a thrust in the X-axial direction.

The magnet units 25 a, 25 b can be arranged on the left and right sidesof the center line A as shown in FIG. 2, and further, they can bearranged to be left-right symmetric. Further, if a large moment force isdesired, plural pairs of magnet units (e.g., 25 a and 25 b) can beprovided, rather than one pair.

With the use of the stage configuration according to at least oneexemplary embodiment, since the coils are used for both drive in ahorizontal direction and drive in the θz direction, it is possible toreduce the provision of an additional current driver for the drive inthe θz direction. Thus, the stage can be small-sized, and accordingly,an exposure device can be also small-sized as a whole. Further, in orderto induce thrusts in the X-, Y- and Z-axial directions and the θx and θydirections, the magnets in the Halbach array can be tightly laid in asquare shape with no missing, thereby it is possible to enhance theefficiency for inducing the thrusts.

It is noted that although the thrust in the θz direction is induced inthe stage by the first coil layer, according to at least one exemplaryembodiment, the thrust in the θz direction can be induced by the secondcoil layer. In this case, the magnet units 25 a, 25 b are arranged so asto interpose therebetween the magnet unit 24 in the X-axial direction.

(Example of an Exposure Device)

Referring to FIG. 5 which illustrates an exposure device formanufacturing a semiconductor device using a stage unit similar to thatmentioned above, as a wafer stage. The exposure device can be used formanufacturing a device formed from a fine pattern, for example, asemiconductor device (e.g., a semiconductor integrated circuit, a micromachine, a thin film magnetic head, other pattern formed devices bothmacro, micro, and nano in size as known by one of ordinary skill in therelevant art and equivalents). An exposure beam (e.g., a visible lightbeam, an ultraviolet beam, an EUV beam, an X-ray radiation, an electronbeam and other exposure beams as known by one of ordinary skill in therelevant arts and equivalents) from an illumination system unit 101,irradiates, after passing through a reticle with an original pattern andvia a projection lens 103 (e.g., a refractive lens, a reflection lens, acatadioptric lens system, a charged particle lens and other projectionlens systems as known by one of ordinary skill in the relevant arts andequivalents), a semiconductor wafer (substrate) forming a pattern of theoriginal on the substrate, which can be mounted on the wafer stage 104.Further, in such an exposure device, as the wavelength of the exposurebeam becomes shorter, exposure has been carried out more in a vacuumenvironment. A wafer (an object to be irradiated) as a substrate is heldon a chuck installed on the wafer stage 104, and a reticle containing anoriginal (i.e., an original pattern) to be exposed is mounted on areticle stage 102 and is illuminated to transferred onto one of zones onthe wafer in a step-and-repeat mode or a step-and-scan mode by theillumination system unit 101. It is noted here that the above-mentionedmovement of the stage in exemplary embodiments can be used to move thewafer stage 104 or the reticle stage 102.

(An Example of a Method of Manufacturing a Device)

Next, explanation will be made of a process of manufacturing asemiconductor device with the use of the above-mentioned exposure deviceillustrated in FIG. 5. FIG. 6 is a view illustrating a flow-chart forexplaining a process of manufacturing a semiconductor device. At step 1(S1) (circuit design), a circuit design for a semiconductor device iscarried out. At step 2 (S2) (manufacture of a mask), a mask is formed inaccordance with the designed circuit pattern.

Meanwhile, at step 3 (S3) (manufacture of a wafer), a wafer ismanufactured with the use of a material (e.g., silicon). Step 4 (S4)(wafer process) as the so-called preprocess, an actual circuit is formedon the wafer with the use of the mask and the wafer as mentioned above(e.g., by using lithography technology using the above-mentionedexposure device). The next step 5 (S5) (assembly) is the so-calledpost-process, a semiconductor chip is obtained with the use of the wafermanufactured by the step 4 (S4), this step 5 (S5) can include anassembling step which can include an assembly step (dicing, bonding),and a package step (chip enclosure). At step 6 (S6) (inspection), aninspection including an operation confirming test, and a duration testis carried out for the semiconductor device manufactured at step 5 (S5).Through the above-mentioned steps, the semiconductor device iscompleted. Thus, at step 7 (S7), the semiconductor device is delivered.

The wafer process at the above-mentioned step 4 (S4) can include thefollowing steps (FIG. 7): a CVD step (S12) of forming an insulation filmon the outer surface of the wafer, an electrode forming step (S13) offorming electrodes on the wafer by vapor deposition, an ion implantationstep (S14) of implanting ions in the wafer and subsequent oxidation(S11), a resist process step (S15) of coating a photo-sensitive materialon the wafer, an exposure step (S16) of transferring a circuit patternby the exposure device onto the wafer after the resist process step, adeveloping step (S17) of developing the wafer exposed at the exposurestep, an etching step (S18) of grinding a part other than the resistimage developed at the developing step, and a resist peel-off step (S19)of removing the resist after the etching. With the repetitions of theabove-mentioned steps, circuit pattern in multi-layers are formed on thewafer.

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

1. A positioning apparatus, configured for moving a movable memberrelative to a base member by a surface motor, comprising: a first coilunit including a plurality of coils which are arranged in an X-axialdirection and which have a longer length in a Y-axial direction than inthe X-axial direction, wherein an X-axis is perpendicular to a Y-axis; asecond coil unit including a plurality of coils which are arranged inthe Y-axial direction and which have a longer length in the X-axialdirection than in the Y-axial direction; a first magnet unit configuredto generate a force to the movable member in the X-axial direction incooperation with the first coil unit and to generate a force to themovable member in the Y-axial direction in cooperation with the secondcoil unit; and a second magnet unit configured to generate a force tothe movable member in a rotational direction around a Z-axis incooperation with either the first coil unit or the second coil unit,wherein the Z-axis is perpendicular to both of the X-axis and theY-axis, wherein the second magnet unit consists of two magnet rows, afirst one of the magnet rows being arranged on a first side of the firstmagnet unit and a second one of the magnet rows being, arranged on asecond side opposite to the first side of the tt st magnet unit, andwherein each magnet row consists of a plurality of magnets arrangedone-dimensionally such that N-poles and S-poles are alternately arrangedin a single row in the X-axial direction or in the Y-axial direction. 2.An exposure device for exposing a pattern onto a substrate, wherein thesubstrate is positioned with the use of a positioning apparatusaccording to claim 1.